555.13 Marina bonding
What changed in 555.13
New bonding rule: metal touching the water, metal piping and other metal that could become energized gets bonded to the panelboard grounding bus with solid copper, 8 AWG or larger.
Point by point
- Bond metal parts touching the water, every metal pipe, and any non-current-carrying metal that could become energized.
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- 3 more points on exactly what changed
- The 2017 rule next to the 2020 rule, side by side
- Why it changed
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This section across NEC® editions
2020 NEC®NewYou're here
New bonding rule: metal touching the water, metal piping and other metal that could become energized gets bonded to the panelboard grounding bus with solid copper, 8 AWG or larger.
2023 NEC®Revised
Metal parts already grounded through a circuit's EGC no longer need a separate bond to the panelboard. Other metal parts still get bonded with 8 AWG solid copper.
Open the 2023 page →2026 NEC®No change
This section did not change from 2023 to 2026.
More 2020 changes in Article 555
This is a plain-English summary, not the NEC®'s exact wording. Always check the full section in the NEC® edition your area has adopted, plus any local amendments.
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